IEC 61190-1-1:2002

Title

Language: EN Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Language: FR Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Abstract

Language: EN Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
25.03.2002
TC 91
ICS Codes
31.190
Publication number
61190
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€ 127,30 (Download and hardcopy)
Delivery format
postal download (41 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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