IEC 60749-40:2011

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais climatiques et mécaniques - Partie 40: Méthode d'essai de chute au niveau de la carte avec utilisation d'une jauge de contrainte

Abstract

Language: EN IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
13.07.2011
TC 47
ICS Codes
31.080.01
Publication number
60749
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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