IEC 62880-1:2017

Title

Language: EN Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Abstract

Language: EN IEC 62880-1:2017(E) describes a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV). This method is to be conducted primarily at the wafer level of production during technology development, and the results are to be used for lifetime prediction and failure analysis. Under some conditions, the method can be applied to package-level testing. This method is not intended to check production lots for shipment, because of the long test time.

Language(s)
Language: EN
Edition
1.0
Date of issue
23.08.2017
TC 47
ICS Codes
31.080.01
Publication number
62880
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