IEC 62047-12:2011

Title

Language: EN Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Language: FR Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS)

Abstract

Language: EN IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 10 12 ) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
13.09.2011
TC 47/SC 47F
ICS Codes
31.080.99
Publication number
62047
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