IEC 62047-9:2011/COR1:2012

Title

Language: EN Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Language: FR Corrigendum 1 - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 9: Mesure de la résistance de collage de deux plaquettes pour les MEMS

Abstract

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Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
08.03.2012
TC 47/SC 47F
ICS Codes
31.080.99
Publication number
62047
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