IEC 61191-2:2017


Language: EN Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies


Language: EN IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a)   the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b)   some of the terminology used in the document has been updated; c)   references to IEC standards have been corrected; d)   five termination styles have been added.

Language: EN
Date of issue
TC 91
ICS Codes
31.190, 31.240
Publication number

To use the preview feature, please enable JavaScript in your Browser

Price (excl. VAT)
€ 181,80 (Download and hardcopy)
Delivery format
postal download (33 Pages)




Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.