IEC 62258-6:2006

Title

Language: EN Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Abstract

Language: EN Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Language(s)
Language: EN
Edition
1.0
Date of issue
28.08.2006
TC 47
ICS Codes
31.080.99
Publication number
62258
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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