IEC 61189-5-3:2015


Language: EN Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Language: FR Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-3: Méthodes d'essai des assemblages de cartes imprimées: Pâte de brasage


Language: EN IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering. This publication is to be read in conjunction with IEC 61189-1:1997 , IEC 61189-2:2006 and IEC 61189-3:2007 .

Language: EN Language: FR
Date of issue
TC 91
ICS Codes
Publication number

To use the preview feature, please enable JavaScript in your Browser

Price (excl. VAT)
€ 181,80 (Download and hardcopy)
Delivery format
postal download (79 Pages)




Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.