IEC TR 62258-7:2007

Title

Language: EN Semiconductor die products - Part 7: XML schema for data exchange

Abstract

Language: EN This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

Language(s)
Language: EN
Edition
1.0
Date of issue
23.08.2007
TC 47
ICS Codes
31.080.99
Publication number
62258
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