IEC 60191-6-17:2011

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-17: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers empilés - Boîtiers matriciels à billes et à pas fins et boîtiers matriciels à zone de contact plate et à pas fins (P-PFBGA et P-PFLGA)

Abstract

Language: EN IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
27.01.2011
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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€ 154,50 (Download and hardcopy)
Delivery format
postal download (53 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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