IEC 60191-6-22:2012

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-22: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers matriciels à billes et à pas fins en silicium et boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FBGA et S-FLGA)

Abstract

Language: EN IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
11.12.2012
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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Price (excl. VAT)
€ 90,90 (Download and hardcopy)
Delivery format
postal download (34 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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