IEC 61192-4:2002

Title

Language: EN Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Language: FR Exigences relatives à la qualité d'exécution des assemblages électroniques brasés - Partie 4: Assemblage au moyen de bornes

Abstract

Language: EN Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
29.11.2002
TC 91
ICS Codes
31.190
Publication number
61192
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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