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IEC 60749-8:2002/COR1:2003

Title

Language: EN Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Language: FR Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8: Etanchéité

Abstract

Language(s)

Edition

1.0

Date of issue

23.04.2003

TC 47

ICS Codes

31.080.01

Publication number

60749

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IEC 60749-8:2002/COR1:2003