IEC 60749-8:2002/COR1:2003

Title

Language: EN Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Language: FR Corrigendum 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8: Etanchéité

Abstract

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Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
23.04.2003
TC
TC 47
ICS Codes
31.080.01
Publication number
60749
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