IEC 61189-1:1997+AMD1:2001 CSV (Consolidated version)

Title

Language: EN Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Language: FR Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 1: Méthodes d'essai générales et méthodologie

Abstract

Language: EN This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

Language(s)
Language: EN Language: FR
Edition
1.1
Date of issue
22.11.2001
TC 91
ICS Codes
31.180
Publication number
61189
Preview

To use the preview feature, please enable JavaScript in your Browser


Price (excl. VAT)
€ 136,40 (Download and hardcopy)
Delivery format
postal download (51 Pages)

Warenkorb

Back

Legend

Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.