IEC 60286-3:2013


Language: EN Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Language: FR Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues


Language: EN IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Language: EN Language: FR
Date of issue
TC 40
ICS Codes
31.020, 31.240
Publication number

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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