IEC 61188-5-6:2003

Title

Language: EN Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Language: FR Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-6: Considérations sur les liaisons pistes-soudures - Composants à sorties en J sur quatre côtés

Abstract

Language: EN Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
23.01.2003
TC 91
ICS Codes
31.190
Publication number
61188
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Price (excl. VAT)
€ 90,90 (Download and hardcopy)
Delivery format
postal download (37 Pages)

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Legend

Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

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