IEC 60191-6-2:2001

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-2: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broches en forme de billes et de colonnes, avec des pas de 1,50 mm, 1,27 mm et 1,00 mm

Abstract

Language: EN IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Language(s)
Language: EN
Edition
1.0
Date of issue
11.12.2001
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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€ 36,40 (Download and hardcopy)
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postal download (10 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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