IEC 60749-35:2006

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 35: Microscopie acoustique pour composants électroniques à boîtier plastique

Abstract

Language: EN Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
18.07.2006
TC 47
ICS Codes
31.080.01
Publication number
60749
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Price (excl. VAT)
€ 127,30 (Download and hardcopy)
Delivery format
postal download (43 Pages)

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