IEC 60749-37:2008

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 37: Méthode d'essai de chute au niveau de la carte avec utilisation d'un accéléromètre

Abstract

Language: EN Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
30.01.2008
TC 47
ICS Codes
31.080.01
Publication number
60749
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Price (excl. VAT)
€ 90,90 (Download and hardcopy)
Delivery format
postal download (39 Pages)

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