IEC 61189-3:2007

Title

Language: EN Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Language: FR Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

Abstract

Language: EN IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows: - 6 V: Visual test methods: 3V01, 3V02 and 3V03; - 7 D: Dimensional test methods: 3D03; - 8 C: Chemical test methods: 3C02, 3C13 and 3C14; - 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09; - 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18; - 11 N: Environmental test methods: 3N03, 3N07 and 3N12; - 12 X: Miscellaneous test methods: 3X01.

Language(s)
Language: EN Language: FR
Edition
2.0
Date of issue
09.10.2007
TC 91
ICS Codes
31.180
Publication number
61189
Preview

To use the preview feature, please enable JavaScript in your Browser


Price (excl. VAT)
€ 290,90 (Download and hardcopy)
Delivery format
postal download (241 Pages)

Warenkorb

Back

Legend

Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.