IEC 60191-6-4:2003

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-4: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les dimensions des boîtiers matriciels à billes (BGA)

Abstract

Language: EN IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Language(s)
Language: EN
Edition
1.0
Date of issue
11.06.2003
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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