IEC 61163-1:2006

Title

Language: EN Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

Language: FR Déverminage sous contraintes - Partie 1: Assemblages réparables fabriqués en lots

Abstract

Language: EN This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.

Language(s)
Language: EN Language: FR
Edition
2.0
Date of issue
26.06.2006
TC 56
ICS Codes
03.120.01, 03.120.30, 21.020
Publication number
61163
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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