IEC 61760-4:2015

Title

Language: EN Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Language: FR Technique du montage en surface (SMT) - Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité

Abstract

Language: EN IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
19.05.2015
TC 91
ICS Codes
31.190
Publication number
61760
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