IEC 60191-6-8:2001

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-8: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers plats quadrangulaires en céramique, scellement verre (G-QFP)

Abstract

Language: EN IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
27.08.2001
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
Preview

To use the preview feature, please enable JavaScript in your Browser


Price (excl. VAT)
€ 36,40 (Download and hardcopy)
Delivery format
postal download (22 Pages)

Warenkorb

Back

Legend

Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.