IEC 60191-6-12:2011

Title

Language: EN Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Language: FR Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-12: Règles générales pour la préparation des dessins d'encombrement des boîtiers des dispositifs à semiconducteurs à montage en surface - Lignes directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

Abstract

Language: EN IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised.

Language(s)
Language: EN Language: FR
Edition
2.0
Date of issue
08.06.2011
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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Mandatory Standard according current regulation Mandatory Standard according current regulation

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