IEC 61188-5-4:2007

Title

Language: EN Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Language: FR Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-4: Considérations sur les liaisons pistes-soudures - Composants à sorties en J sur deux côtés

Abstract

Language: EN IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
30.10.2007
TC
TC 91
ICS Codes
31.180
Publication number
61188
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