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IEC 61188-5-4:2007

Title

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-4: Considérations sur les liaisons pistes-soudures - Composants à sorties en J sur deux côtés

Abstract

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Language(s)

Edition

1.0

Date of issue

30.10.2007

TC

TC 91

ICS Codes

31.180

Publication number

61188

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Price (excl. VAT)

€ 63,60 (Download and hardcopy)

Delivery format

(29 Pages)

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