IEC 60749-15:2010

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Language: FR Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants

Abstract

Language: EN IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

Language(s)
Language: EN Language: FR
Edition
2.0
Date of issue
28.10.2010
TC 47
ICS Codes
31.080.01
Publication number
60749
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€ 18,20 (Download and hardcopy)
Delivery format
postal download (14 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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