IEC 61192-2:2003

Title

Language: EN Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

Language: FR Exigences relatives à la qualité d'exécution des assemblages électroniques brasés - Partie 2: Assemblage par montage en surface

Abstract

Language: EN Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
14.03.2003
TC 91
ICS Codes
31.190
Publication number
61192
Preview

To use the preview feature, please enable JavaScript in your Browser


Price (excl. VAT)
€ 272,70 (Download and hardcopy)
Delivery format
postal download (127 Pages)

Warenkorb

Back

Legend

Document for download (PDF) PDF document (download version)
ZIP File for download ZIP file (download version)
Shipping item Paper (print version)/shipping item
Adobe DRM ePub File E-book (Adobe DRM ePub)
Storage medium Storage medium
Database Database
Bezugsart Online Viewing access (7-days available online)
Mandatory Standard according current regulation Mandatory Standard according current regulation

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. For information on cookies, please look at our privacy statement.