IEC 60749-25:2003

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 25: Cycles de température

Abstract

Language: EN Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
11.07.2003
TC 47
ICS Codes
31.080.01
Publication number
60749
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€ 63,60 (Download and hardcopy)
Delivery format
postal download (25 Pages)

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Mandatory Standard according current regulation Mandatory Standard according current regulation

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