IEC 60191-6-18:2010/COR1:2010

Title

Language: EN Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Language: FR Corrigendum 1 - Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

Abstract

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Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
31.05.2010
TC 47/SC 47D
ICS Codes
31.080.01
Publication number
60191
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