IEC 60749-22:2002

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 22: Robustesse des contacts soudés

Abstract

Language: EN Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
12.09.2002
TC 47
ICS Codes
31.080.01
Publication number
60749
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€ 127,30 (Download and hardcopy)
Delivery format
postal download (41 Pages)

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