IEC 60749-16:2003

Title

Language: EN Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

Language: FR Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 16: Détection de bruit d'impact de particules (PIND)

Abstract

Language: EN Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

Language(s)
Language: EN Language: FR
Edition
1.0
Date of issue
17.01.2003
TC 47
ICS Codes
31.080.01
Publication number
60749
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€ 18,20 (Download and hardcopy)
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